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Flip chip
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#	Item
21	Design and Measurement of Matched Wire Bond and Flip Chip Interconnects for D-Band System-in-Package Applications S. Beer, B. Ripka, S. Diebold, H. Gulan, C. Rusch, P. Pahl, T. Zwick Institut fuer Hochfrequenztechnik und Add to Reading List Source URL: www.success-project.eu Language: English - Date: 2011-11-02 05:29:30 Semiconductor device fabrication Integrated circuits Wire bonding Flip chip Antenna Transmission line Microwave System in package Three-dimensional integrated circuit Electronic engineering Technology Electronics
22	a FEATURES 12-Bit CMOS DAC with On-Chip Voltage Reference Output Amplifier Three Selectable Output Ranges Add to Reading List Source URL: www.farnell.com Language: English - Date: 2015-01-19 20:02:15 Electromagnetism Integrated circuits Electronic circuits Digital electronics Digital-to-analog converter Differential nonlinearity Operational amplifier Flip-flop IC power supply pin Electronic engineering Electronics Digital signal processing
23	Medical technology Microassembly Miniaturized electronics Developing innovative solutions Microassembly Add to Reading List Source URL: www.cicor.com Language: English - Date: 2014-07-29 12:46:57 Flip chip Semiconductor device fabrication Wire bonding 100 micrometres
24	The 6th International Workshop on System on Chip for Real Time Applications A generic Olivier Add to Reading List Source URL: ofaurax.free.fr Language: English - Date: 2008-03-30 13:19:57 Software quality Digital electronics Logic gates Fault injection Software testing Flip-flop Fault-tolerant system Fault-tolerant design VHDL Computing Geology Systems engineering
25	HDI Draper’s high-density interconnect technology utilizes our patented waferscale injection molding processes to create mechanically robust, miniature circuit boards compatible with state-of-the-art surface mount asse Add to Reading List Source URL: www.draper.com Language: English - Date: 2014-03-10 12:05:00 Electronic engineering Semiconductor device fabrication Electrical engineering Printed circuit board Wafer Flip chip Solder 100 micrometres Via Electronics manufacturing Electronics Electromagnetism
26	AVR151: Setup And Use of The SPI Features • • • • Add to Reading List Source URL: fab.cba.mit.edu Language: English - Date: 2013-11-28 19:18:00 Computer hardware Electronic engineering Embedded systems Chip select Computer memory Digital timing diagram Microcontroller Flip-flop Serial Peripheral Interface Bus Electronics Digital electronics
27	Microsoft PowerPoint - Investor Presentation November 2013.pptx Add to Reading List Source URL: www.besi.com Language: English - Date: 2014-10-30 11:29:14 Wire bonding Semiconductor device fabrication Flip chip Financial ratio
28	Investor Presentation Q2-2014 Add to Reading List Source URL: www.besi.com Language: English - Date: 2014-10-30 11:21:46 Wire bonding Solder Bond Technology Manufacturing Semiconductor device fabrication Flip chip Materials science
29	Esec 2100 FC plus Driving Innovation Add to Reading List Source URL: www.besi.com Language: English - Date: 2014-12-02 02:31:34 Microtechnology Semiconductor device fabrication Three-dimensional integrated circuit Flip chip Integrated circuits Electronics Electronic engineering
30	Investor Presentation Q4-2014 Add to Reading List Source URL: www.besi.com Language: English - Date: 2015-03-02 04:24:17 Semiconductor device fabrication Materials science Chemistry Flip chip Solder IDMS

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